Cryo Electron Microscopy Short Course 2011

THE NEXT COURSE WILL BE OFFERED SUMMER 2013  (date TBD)

July 13-15, 2011, Wednesday-Friday
Keller Hall 3-180 (first floor)
U of MN, Minneapolis East Bank Campus

Offered by IPrime's Nanostructural Materials and Processes Program
Coordinator: Professor and NMP Program Leader Alon McCormick

Description
This short course will enable industrial and academic scientists and engineers, with no prior knowledge of electron microscopy, to gain insight into cryo-techniques to image nanostructures in liquids, soft materials, and biological systems.

After attending the course you will be better able to assess what experiments are feasible for samples of interest to you, and to estimate the benefits and costs of these approaches.

Course brochure - please distribute.

Instructors
The instructors are innovators and leaders in the field of cryo-electron microscopy, particularly in the study of soft materials, nanomaterials, and virus structure.

• Jayesh Bellare, Indian Institute of Technology, Bombay

• Chris Frethem, U of MN Characterization Facility (CharFac)

• Ishi Talmon, Technion, Israel Institute of Technology

• Joe Zasadzinski, U of MN Chemical Engineering and Materials Science

• Wei Zhang, U of MN CharFac and Institute for Molecular Virology


Registration and Fees
Registration is closed.

Course fee: $2000 includes instruction, lab demonstrations, course materials, lunches, refreshment breaks, and reception.

Discounted rate: $1600 for IPrime members

If you are unable to attend, you may send a substitute or you may receive a refund, minus a $300 cancellation fee, if a written request is made at least a week in advance of the course. The University reserves the right to cancel the course if necessary, with a full refund.

Net proceeds from the course to support educational efforts at the Characterization Facility.

This course is sponsored by Nanostructural Materials and Processes Program, Chemical Engineering and Materials Science Department and IPRIME -Industrial Partnership for Research in Interfacial and Materials Engineering.